Focus on Second Open Call winners: AI-Driven Packaging Defect Detection System– AIPack

WHAT ABOUT THE EXPERIMENT? 

The AI-Driven Packaging Defect Detection System (AIPack) is a forward-thinking industrial experiment developed by TIKPACK LLC, a Ukrainian-based packaging company, in partnership with AI development firm Mind Studios. The project is funded under AI REDGIO 5.0 (Horizon Europe), aiming to demonstrate how AI-at-the-Edge can transform quality control in high-speed manufacturing.

TIKPACK specializes in packaging grain-based products and serves both private-label clients and international humanitarian organizations such as the World Food Programme. At present, quality inspection on their lines is performed manually—an approach prone to errors, delays, and increased waste. The defect rate averages around 1%, leading to nearly 220 defective packages per day.

AIPack solves this with an intelligent, real-time quality control system. It uses AI-driven computer vision, edge computing, and smart sensors to automatically detect and reject faulty packaging without slowing down production.Key issues addressed include:

• Misaligned seals from film shifting,

• Improper cuts due to photo marker failure,

• Sealing inconsistencies caused by environmental factors,

• Product clumping or under-filled packages.

The system will be installed on a packaging line that processes 22,000 PP pillow-style packages per shift. By identifying problems instantly and without human intervention, the system is expected to reduce the defect rate from 1% to 0.1%, saving around €39,000 annually.

AIPack’s architecture is modular, scalable, and open-source compatible, designed for interoperability across other production environments. While the current experiment focuses on defect detection, the system is built to evolve toward corrective actions, such as adjusting machine parameters to fix recurring issues without stopping the line.

The 6-month implementation includes four key phases:

1. Defect research and system planning

2. Installation of cameras, sensors, and edge devices

3. Development and training of AI software

4. System validation and performance reporting

AIPack will deliver a Technology Readiness Level (TRL) 6–7 prototype, demonstrating a fully functional solution in a real industrial environment.

The project also contributes to TIKPACK’s sustainability roadmap. Reducing waste and defective packaging aligns with circular economy goals and Industry 5.0 values. In parallel, the company is also testing paper-based packaging materials and transitioning to solar energy to reduce environmental impact.

AIPack positions TIKPACK as an innovator in smart packaging while offering a roadmap for other manufacturers to adopt cost-efficient, AI-powered solutions at the edge.

WHAT IS THE EXPECTED IMPACT?

The AIPack experiment is expected to bring significant technological, economic, and commercial impact both within TIKPACK and across the wider manufacturing sector.

Technological Impact

The AI-based system will eliminate reliance on manual inspection, introducing automated real-time quality control into high-speed packaging lines. This transition not only improves accuracy (target: 95%+ detection) but also allows continuous defect logging and analysis—unlocking data-driven production optimization. The system’s modular, open-source-compatible architecture ensures scalability across TIKPACK’s other lines and potential adaptation in sectors like pharmaceuticals or consumer goods.

Economic Impact

Reducing the defect rate from 1% to 0.1% will yield substantial financial benefits—saving approximately €39,000 per year through waste reduction and improved productivity. By preventing defective products from reaching customers or partners (including the World Food Programme), the system minimizes reputational and logistical risks.

Commercial Impact

Beyond internal efficiency, AIPack represents a new business direction for TIKPACK. The solution can be commercialized as a service for other packaging firms, with customizable AI modules and integration support. Demonstrating this technology at events like GulFood 2025 will boost international visibility and establish TIKPACK as a regional leader in AI-powered packaging innovation.

In sum, AIPack not only meets the immediate needs of TIKPACK’s operations but also creates long-term potential for market expansion, cross-sector applicability, and broader industry adoption of edge AI technologies.